単一電子が半導体チップに与える損傷を説明する新モデル(New model explains how single electrons cause damage inside silicon chips)

2026-04-14 カリフォルニア大学サンタバーバラ校(UCSB)

米国のカリフォルニア大学サンタバーバラ校の研究チームは、単一電子がシリコンチップ内部で損傷を引き起こす仕組みを説明する新モデルを提案した。半導体デバイスでは微小スケールでの電子の挙動が信頼性に大きく影響するが、本研究は単一電子によるエネルギー移動や欠陥生成の過程を理論的に解明した点が特徴である。このモデルにより、放射線やノイズに起因するチップ障害の発生メカニズム理解が進み、より高信頼な電子デバイス設計への応用が期待される。特に微細化が進む半導体において重要な知見となる。

単一電子が半導体チップに与える損傷を説明する新モデル(New model explains how single electrons cause damage inside silicon chips)
Photo Credit:Illustration by Woncheol Lee
A concept illustration depicting a single “hot electron” causing a hydrogen-silicon bond to break, degrading performance

<関連情報>

固体システムにおける共鳴状態と核ダイナミクス:シリコン-水素結合解離の事例 Resonant states and nuclear dynamics in solid-state systems: The case of silicon-hydrogen bond dissociation

Woncheol Lee, Mark E. Turiansky, Dominic Waldhör, Byounghak Lee, Tibor Grasser, and Chris G. Van de Walle
Physical Review B  Published: 11 February, 2026
DOI: https://doi.org/10.1103/3ync-nxm8

Abstract

Bond breaking in the presence of highly energetic carriers is central to many important phenomena in physics and chemistry, including radiation damage, hot-carrier degradation, activation of dopant-hydrogen complexes in semiconductors, and photocatalysis. Describing these processes from first principles has remained an elusive goal. Here we introduce a comprehensive theoretical framework for the dissociation process, emphasizing the need for a nonadiabatic approach. We develop the methodology and benchmark the results for the case of silicon-hydrogen bond dissocation, a primary process for hot-carrier degradation. Passivation of Si dangling bonds by hydrogen is vital in all Si devices because it eliminates electrically active mid-gap states; understanding the mechanism for dissociation of these bonds is therefore crucial for device technology. While the need for a nonadiabatic approach has been previously recognized, explicitly obtaining diabatic states for solid-state systems has been an outstanding challenge. We demonstrate how to obtain these states by applying a partitioning scheme to the Hamiltonian obtained from first-principles density functional theory. This approach enables us to identify the Si-H bonding (δ) and antibonding (δ*) states, from which we extract their energy eigenvalues and map the associated potential-energy surfaces. Our results demonstrate that bond dissociation can occur when electrons temporarily occupy the antibonding states, generating a highly repulsive excited-state potential that causes the hydrogen nuclear wave packet to shift and propagate rapidly. Based on the Menzel-Gomer-Redhead (MGR) model, we show that after moving on this excited-state potential on femtosecond timescales, a portion of the nuclear wave packet can continue to propagate even after the system relaxes back to the ground state, allowing us to determine the dissociation probability. By averaging over quantum trajectories, we calculate a quantum yield that directly aligns with experimentally measured desorption yields. Our model effectively explains key experimental features—such as the 7 V threshold bias for dissociation, as well as the presence of a finite dissociation probability even at lower bias ranges, the high isotope ratio between the desorption yields of hydrogen and deuterium, and the temperature independence of the dissociation process—observed in scanning tunneling microscopy (STM) and low-energy electron injection experiments. Finally, we apply our approach to a representative device scenario, demonstrating its capability to explain the degradation observed in oxide-stress experiments. Our results provide essential insights into the fundamental processes that drive carrier-induced bond breaking in general, and specifically elucidate hydrogen-related degradation in Si devices, with potential implications for improving device reliability and performance.

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