記録的な熱伝導材料の発見(Researchers discover record-setting heat-conducting material)

2026-04-09 アルゴンヌ国立研究所(ANL)

米国のArgonne National Laboratoryの研究チームは、これまでで最高レベルの熱伝導性能を持つ新材料を発見した。この材料は、熱を効率的に運ぶフォノン(格子振動)の散乱が極めて少ない構造を持ち、従来材料を大きく上回る熱伝導率を実現する。特に結晶構造の対称性や原子配列が重要な役割を果たし、熱輸送の損失を最小限に抑えている。研究では理論計算と実験を組み合わせて性能を検証し、電子機器の冷却やエネルギー効率向上への応用が期待されるとした。今後は、大規模製造や実用環境での性能維持が課題となるが、次世代の熱管理技術に大きな可能性を示す成果である。

記録的な熱伝導材料の発見(Researchers discover record-setting heat-conducting material)
Electron microscope image (left) and X-ray diffraction image (right) of a single crystal of theta-phase tantalum nitride. (Images courtesy of Yongjie Hu/UCLA.)

<関連情報>

金属θ相窒化タンタルの熱伝導率は銅の3倍である Metallic θ-phase tantalum nitride has a thermal conductivity triple that of copper

Suixuan Li, Chuanjin Su, Zihao Qin, Ahmet Alatas, […] , and Yongjie Hu
Science  Published:15 Jan 2026
DOI:https://doi.org/10.1126/science.aeb1142

Editor’s summary

Single crystals of the θ-phase of tantalum nitride have an ultrahigh thermal conductivity, consistent with previous theoretical predictions. Li et al. used time-domain thermoreflectance to show that their samples had a thermal conductivity about three times greater than that of copper. Inelastic x-ray scattering revealed that phonon-phonon scattering, which reduces thermal conductivity, was suppressed. —Phil Szuromi

Abstract

Efficient heat dissipation is fundamentally limited by intrinsic scattering mechanisms that cap the thermal conductivity of metallic materials such as copper to ~400 watts per meter-kelvin. Here we report the experimental realization of single-crystalline θ-phase tantalum nitride (θ-TaN), a metastable transition metal nitride predicted to overcome this limitation. We measured a room-temperature thermal conductivity of ~1100 watts per meter-kelvin, nearly three times that of copper. Synchrotron-based inelastic x-ray scattering revealed a distinctive phonon band structure with a large acoustic-optical gap and phonon bunching, which suppress phonon-phonon scattering. Ultrafast optical spectroscopy confirmed exceptionally weak electron-phonon coupling and validated first-principles calculations. These findings redefine the thermal transport limits of metallic materials and open new opportunities for advancing thermal management in electronics and power systems.

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