2026-07-09 東京科学大学

図1. 6G端末に向けたサブテラヘルツ波二偏波MIMOによる100 Gbps超の高速通信
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6G UE向け65nm CMOSプロセスによる144Gbps Dバンドデュアル偏波MIMO高密度フェーズドアレイ送受信機 A 144Gbps D-Band Dual-Polarized MIMO High-Density Phased-Array Transceiver in 65nm CMOS for 6G UE
Yudai Yamazaki; Ryuji Kinugawa; Takumi Kojima; Takaya Uchino; Anyi Tian; Chenxin Liu,…
2026 IEEE/JSAP Symposium on VLSI Technology and Circuits Date Added to IEEE Xplore: 03 July 2026
DOI:https://doi.org/10.1109/VLSITechnologyandCir65830.2026.11577332
Abstract
This work presents the world’s first D-band dual-polarized (DP) multi-input and multi-output (MIMO) phased-array transceiver targeting 6G user equipment (UE), fabricated in a 65 nm CMOS process. The proposed transceiver achieves a maximum data rate of 144 Gbps. Each IC integrates 4 vertical (V) and 4 horizontal (H) polarized TRX elements in a compact layout, resulting in power consumption per element of 124 mW in TX and 90 mW in RX. Furthermore, the transceiver is embedded within a high-power-density antenna-in-package (AiP) module, enabling long-distance single-stream communication up to 50 meters.


