2026-07-28 九州大学
電気回路とアクチュエータを一体化した薄膜回路モジュールAが、電気入力によって変形し、ドッキング機構を介して薄膜回路モジュールBと機械的・電気的に接続する様子。
＜関連情報＞
- https://www.kyushu-u.ac.jp/ja/researches/view/1527
- https://www.nature.com/articles/s41528-026-00606-9
キネティックエレクトロニクスに基づく薄膜ロボットおよび電子モジュール用の電気機械式ドッキングおよびアンドッキング機構 Electromechanical docking and undocking mechanisms for thin-film robotic and electronic modules based on kinetic electronics
Shunsuke Uchima,Jiani Cai,Kenshi Hayashi & Fumihiro Sassa
npj Flexible Electronics Published:17 July 2026
DOI:https://doi.org/10.1038/s41528-026-00606-9
Abstract
Reconfigurable module-level interconnection across small-scale robotic systems and thin-film electronic systems remains limited, particularly in terms of active connection formation, reversible mechanical coupling, and electrical continuity. In this study, we report active electromechanical docking and undocking mechanisms for thin-film robotic and electronic modules based on kinetic electronics. We developed a single-plane probe assembly mechanism and a separation module assembly mechanism. These mechanisms operate at 5–12 V and establish simultaneous mechanical coupling and electrical continuity that persist in the unpowered state. During docking, the probe mechanism achieved 10 mm deformation at 1.1 W, whereas the separation module mechanism exhibited a mean operating power of 0.43 W and a mean maximum holding force of 618 mgf (6.1 mN). These results demonstrate a proof-of-concept for reversible active electromechanical interconnection for thin-film module systems.
