2026-04-22 中国科学院（CAS）
＜関連情報＞
- https://english.cas.cn/newsroom/cas-in-media/202604/t20260422_1157840.shtml
- https://www.science.org/doi/10.1126/science.aed7758
超ナノドメインにより、銅箔の強度と導電性の相乗効果を実現 Super-nano domains enable strength-conductivity synergy in copper foils
Zhao Cheng, Linhai Liu, Zhiyang Yu, Xiaoyuan Ye, […] , and Lei Lu
Science Published:16 Apr 2026
DOI:https://doi.org/10.1126/science.aed7758
Editor’s summary
Although there are many ways to enhance individual properties in a metal, achieving a combination of ultrahigh tensile strength, high ductility, electrical conductivity, and thermal stability in copper is a challenge because these properties are often mutually exclusive. Cheng et al. showed that the incorporation of organic additives can lead to the stabilization of a layered microstructural architecture that features periodically distributed super-nano domains. The 10-micrometer-thick foils are produced through an industrially scalable electrodeposition process, which thus holds substantial promise for making foils for lithium-ion batteries and integrated circuits. —Marc S. Lavine
Abstract
The development of copper foils that simultaneously exhibit ultrahigh strength, high electrical conductivity, and thermal stability remains a major challenge for advanced electronics and energy storage systems. We report a 10-micrometer-thick copper foil featuring nanoscale grains and periodically distributed gradient super-nano domains (approximately 3 nanometers in size) throughout its thickness that was produced by an industrially scalable electrodeposition process. This copper foil demonstrates a combination of approximately 900-megapascal tensile strength, 90% standard electrical conductivity, and exceptional thermal stability. These superior properties originate from a dual strengthening-stabilization mechanism in which the periodically distributed super-nano domains both enhance strength and stabilize grain boundaries. This strategy not only advances copper foil technology but also provides a general design pathway for developing other scalable, high-performance metallic materials.
