剛性と断熱性を併せ持つユニークな材料を開発(Researchers Create Materials With Unique Combo of Stiffness, Thermal Insulation)

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2024-05-29 ノースカロライナ州立大学(NCState)

研究者たちは、硬くて熱を遮断する材料を開発しました。通常、硬い材料は熱をよく伝え、柔らかい材料は熱を遮断しますが、この研究では両方の特性を持つ材料が見つかりました。この材料は二次元ハイブリッド有機無機ペロブスカイト(2D HOIP)で、有機層と無機層が交互に配置された薄膜です。炭素-炭素鎖をベンゼン環に置き換えることで、材料の剛性と熱絶縁性を調整可能です。また、キラリティを導入することで、材料の剛性や熱伝導率を変えずに他の特性を最適化できる可能性も示されました。この発見は電子機器の熱絶縁コーティングなどに応用が期待されます。

<関連情報>

二次元ハイブリッド金属ハロゲン化物ペロブスカイトにおける熱伝導率と弾性率の異常な相関性 Anomalous Correlation between Thermal Conductivity and Elastic Modulus in Two-Dimensional Hybrid Metal Halide Perovskites

Ankit Negi, Liang Yan, Cong Yang, Yeonju Yu, Doyun Kim, Subhrangsu Mukherjee, Andrew H. Comstock, Saqlain Raza, Ziqi Wang, Dali Sun, Harald Ade, Qing Tu, Wei You, and Jun Liu
ACS Nano  Published:May 24, 2024
DOI:https://doi.org/10.1021/acsnano.3c12172

Abstract

剛性と断熱性を併せ持つユニークな材料を開発(Researchers Create Materials With Unique Combo of Stiffness, Thermal Insulation)

Device-level implementation of soft materials for energy conversion and thermal management demands a comprehensive understanding of their thermal conductivity and elastic modulus to mitigate thermo-mechanical challenges and ensure long-term stability. Thermal conductivity and elastic modulus are usually positively correlated in soft materials, such as amorphous macromolecules, which poses a challenge to discover materials that are either soft and thermally conductive or hard and thermally insulative. Here, we show anomalous correlations of thermal conductivity and elastic modulus in two-dimensional (2D) hybrid organic–inorganic perovskites (HOIP) by engineering the molecular interactions between organic cations. By replacing conventional alkyl–alkyl and aryl–aryl type organic interactions with mixed alkyl–aryl interactions, we observe an enhancement in elastic modulus with a reduction in thermal conductivity. This anomalous dependence provides a route to engineer thermal conductivity and elastic modulus independently and a guideline to search for better thermal management materials. Further, introducing chirality into the organic cation induces a molecular packing that leads to the same thermal conductivity and elastic modulus regardless of the composition across all half-chiral 2D HOIPs. This finding provides substantial leeway for further investigations in chiral 2D HOIPs to tune optoelectronic properties without compromising thermal and mechanical stability.

0500化学一般
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