レーザー加工を従来比100万倍高速化~半導体分野におけるガラスの微細加工に革新~

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2025-06-12 東京大学

レーザー加工を従来比100万倍高速化~半導体分野におけるガラスの微細加工に革新~

東京大学大学院工学系研究科の伊藤佑介講師らとAGCは、ガラスなど透明素材を従来の100万倍高速で超精密に加工する手法、「ベッセルTSL加工法」を開発しました。レーザーの時間波形(鋭いピコ秒パルス+低強度マイクロ秒パルス)と空間波形(ベッセルビーム)を制御し、1 mm厚ガラスに深さ1 mm・直径3 μmの穴を20 μsで貫通加工。加工装置の低出力化・省エネにも成功しました。この技術は半導体のガラス基板加工に最適で、サファイア、SiC、ダイヤモンドなどへの応用も可能。製造業のパラダイムシフトを促す画期的成果として期待されます。成果は『Science Advances』に掲載済です。

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過渡電子励起による透明材料の超高速レーザー穿孔 Ultrahigh-speed laser drilling of transparent materials via transient electronic excitation

Yanming Zhang, Takumi Koike, Reina Yoshizaki, Guoqi Ren, […] , and Yusuke Ito
Science Advances  Published:11 Jun 2025
DOI:https://doi.org/10.1126/sciadv.adv4436

Abstract

Femtosecond lasers with extremely high peak intensity have driven remarkable advancements in manufacturing across science, medicine, and industry. However, the problem of notably low machining speed remains unsolved. Here, we demonstrate that by transiently exciting electrons in a transparent material, the laser drilling speed is increased by a factor of 1 million compared to that in multishot percussion drilling. By irradiating with a single shot of a spatially shaped ultrashort laser pulse, the optical properties are momentarily changed on the picosecond scale, making the material considerably easier to machine by a successive laser pulse. The selective absorption of laser energy in regions with excited electrons leads to the rapid heating and evaporation of material at an extraordinarily high speed. Furthermore, the machining is achieved using a low-power light source, four orders of magnitude lower than conventional femtosecond lasers. The concept of transiently altering material properties is expected to usher in a paradigm shift in research and development for manufacturing.

0110情報・精密機器
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