2024-10-24 バージニア工科大学(VirginiaTech)
＜関連情報＞
- https://news.vt.edu/articles/2024/10/eng-me-bartlett-nature-electronics-flexible-connections.html
- https://www.nature.com/articles/s41928-024-01268-z
- https://www.nature.com/articles/s43246-021-00169-4
液体金属微小液滴の高速3次元アセンブリによるソフト電子ビアと相互接続 Soft electronic vias and interconnects through rapid three-dimensional assembly of liquid metal microdroplets
Dong Hae Ho,Chenhao Hu,Ling Li & Michael D. Bartlett
Nature Electronics Published:24 October 2024
DOI:https://doi.org/10.1038/s41928-024-01268-z
Abstract
The development of soft electronics requires methods to connect flexible and stretchable circuits. With conventional rigid electronics, vias are typically used to electrically connect circuits with multilayered architectures, increasing device integration and functionality. However, creating vias using soft conductors leads to additional challenges. Here we show that soft vias and planar interconnects can be created through the directed stratification of liquid metal droplets with programmed photocuring. Abnormalities that occur at the edges of a mask during ultraviolet exposure are leveraged to create vertical stair-like architectures of liquid metal droplets within the photoresin. The liquid metal droplets in the uncured (liquid) resin rapidly settle, assemble and then are fully cured, forming electrically conductive soft vias at multiple locations throughout the circuit in a parallel and spatially tunable manner. Our three-dimensional selective stratification method can also form seamless connections with planar interconnects, for in-plane and through-plane electrical integration.
再構成可能でリサイクル可能なソフト・エレクトロニクスのための自己修復液体金属複合材料 Self-healing liquid metal composite for reconfigurable and recyclable soft electronics
Ravi Tutika,A. B. M. Tahidul Haque & Michael D. Bartlett
Communications Materials Published:14 June 2021
DOI:https://doi.org/10.1038/s43246-021-00169-4
Abstract
Soft electronics and robotics are in increasing demand for diverse applications. However, soft devices typically lack rigid enclosures which can increase their susceptibility to damage and lead to failure and premature disposal. This creates a need for soft and stretchable functional materials with resilient and regenerative properties. Here we show a liquid metal-elastomer-plasticizer composite for soft electronics with robust circuitry that is self-healing, reconfigurable, and ultimately recyclable. This is achieved through an embossing technique for on-demand formation of conductive liquid metal networks which can be reprocessed to rewire or completely recycle the soft electronic composite. These skin-like electronics stretch to 1200% strain with minimal change in electrical resistance, sustain numerous damage events under load without losing electrical conductivity, and are recycled to generate new devices at the end of life. These soft composites with adaptive liquid metal microstructures can find broad use for soft electronics and robotics with improved lifetime and recyclability.
