2025-06-18 東京科学大学
図1. 開発した150 GHz帯超小型低消費電力AiPフェーズドアレイ無線機モジュール
＜関連情報＞
- https://www.isct.ac.jp/ja/news/1ngvyv1ozq27
- https://www.isct.ac.jp/plugins/cms/component_download_file.php?type=2&pageId=&contentsId=1&contentsDataId=1754&prevId=&key=4999306cad201e424d66d5a961d4c57f.pdf
- https://www.vlsisymposium.org/
- https://ims-ieee.org/
- https://ieeexplore.ieee.org/document/11023526
6Gに向けたXRアプリケーション向け150GHz帯コンパクトフェーズドアレイAiPモジュール 150 GHz-Band Compact Phased-Array AiP Module for XR Applications Toward 6G
Yohei Morishita; Ken Takahashi; Ryosuke Hasaba; Akihiro Egami; Tomoki Abe; Masatoshi Suzuki;…
IEEE Microwave and Wireless Technology Letters Published:04 June 2025
DOI:https://doi.org/10.1109/LMWT.2025.3565729
Abstract
To realize the practical application of sub-THz band wireless communication toward 6G, it is necessary to develop AiP modules with compact size and low cost. This letter discusses the design of a miniaturized AiP module for high-speed wireless communication targeting extended reality (XR) applications in medical operating rooms as an example of 6G use cases. By integrating waveguide antenna array along with a compact divider/combiner within the multilayer substrates, the module achieves a small form factor of 8.42×20.0×1.37 mm while integrating radio frequency integrated circuit (RFIC) and peripheral surface mount components. The measurement shows a data rate of 40 Gb/s at a 3 m distance in the 150 GHz band with an excellent transmission energy efficiency of 35.7 pJ/bit.
