フレキシブルエレクトロニクス用新基板材料が電子廃棄物対策に役立つ可能性(New substrate material for flexible electronics could help combat e-waste)

2024-08-06 マサチューセッツ工科大学(MIT)

＜関連情報＞

• https://news.mit.edu/2024/new-substrate-flexible-material-could-help-combat-electronic-waste-0806
• https://pubs.rsc.org/en/content/articlelanding/2024/lp/d4lp00182f

電子廃棄物削減のための光パターン形成可能で分解可能な高性能ポリイミドネットワーク基板 Photopatternable, degradable, and performant polyimide network substrates for e-waste mitigation

Caleb J. Reese,Grant M. Musgrave, Jitkanya Wong, Wenyang Pan,John Uehlin,Mason Zadan,Omar M. Awartani,Thomas J. Wallin and  Chen Wang
RSC Applied Polymers  Published:12 Jul 2024
DOI:https://doi.org/10.1039/D4LP00182F

Abstract

The continuous accumulation of electronic waste is reaching alarming levels, necessitating sustainable solutions to mitigate environmental concerns. Fabrication of commercial electronic substrates also requires wasteful high heat. To this end, we develop a series of reprocessible electronic substrates based on photopolymerizable polyimides containing degradable ester linkages. Five imide-containing diallyl monomers are synthesized from readily available feedstocks to produce high-quality substrates via rapid photopolymerization. Such materials possess exceptional thermal (thermal conductivity, K = 0.37–0.54 W m⁻¹ K⁻¹; degradation temperature, T_d > 300 °C), dielectric (dielectric constant, D_k = 2.81–3.05; dielectric loss, D_f < 0.024), and mechanical properties (Young’s modulus, ∼50 MPa; ultimate elongation, dL/L₀ > 5%) needed for flex electronic applications. We demonstrate mild depolymerization via transesterification reactions to recover and reuse the functional components.