中国の科学者、計算能力を向上させる原子レベルの超薄型チップを開発(Chinese scientists develop atoms-thin chips to boost computational power)

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2025-04-05 復旦大学

中国の研究チームが、原子数層の厚さしかない半導体マイクロプロセッサ「WUJI」を開発しました。​この32ビットRISC-Vプロセッサは、二次元半導体を基盤としており、5,900個のトランジスタと25種類の論理ユニットを備えています。WUJIは最大42億のデータポイントに対する加減算処理が可能で、最大10億の命令をプログラムできます。研究チームは、材料成長から統合プロセスまでを精密に制御するために革新的なAIアルゴリズムを活用し、二次元回路のウェハースケール統合における主要な課題を克服しました。この成果は、シリコンを超える二次元集積回路技術の広大な可能性を示しています。

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二次元半導体をベースにしたRISC-V 32ビットマイクロプロセッサ A RISC-V 32-bit microprocessor based on two-dimensional semiconductors

Mingrui Ao,Xiucheng Zhou,Xinjie Kong,Saifei Gou,Sifan Chen,Xiangqi Dong,Yuxuan Zhu,Qicheng Sun,Zhejia Zhang,Jinshu Zhang,Qiran Zhang,Yan Hu,Chuming Sheng,Kaixuan Wang,Shuiyuan Wang,Jing Wan,Jun Han,Wenzhong Bao &Peng Zhou
Nature  Published:02 April 2025
DOI:https://doi.org/10.1038/s41586-025-08759-9

中国の科学者、計算能力を向上させる原子レベルの超薄型チップを開発(Chinese scientists develop atoms-thin chips to boost computational power)

Abstract

Recently the quest for post-silicon semiconductors has escalated owing to the inherent limitations of conventional bulk semiconductors, which are plagued by issues such as drain-induced barrier lowering, interfacial-scattering-induced mobility degradation and a constrained current on/off ratio determined by semiconductor bandwidth. These challenges have prompted the search for more advanced materials, with atomic-layer-thick two-dimensional (2D) semiconductors emerging as a potential solution. Following over a decade of research advances, recent developments in wafer-scale growth and device fabrication have led to breakthroughs in 2D semiconductor electronics. However, the level of integration remains constrained to a few hundred transistors. We describe a reduced instruction set computing architecture (RISC-V) microprocessor capable of executing standard 32-bit instructions on 5,900 MoS2 transistors and a complete standard cell library based on 2D semiconductor technology. The library contains 25 types of logic units. In alignment with advances in silicon integrated circuits, we also co-optimized the process flow and design of the 2D logic circuits. Our combined manufacturing and design methodology has overcome the significant challenges associated with wafer-scale integration of 2D circuits and enabled a pioneering prototype of an MoS2 microprocessor that exemplifies the potential of 2D integrated-circuit technology beyond silicon.

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