2025-05-21 アメリカ合衆国・ジョンズ・ホプキンズ大学
＜関連情報＞
- https://www.jhuapl.edu/news/news-releases/250521-apl-thermoelectrics-enable-compressor-free-cooling
- https://www.nature.com/articles/s41467-025-59698-y
ナノエンジニアリングされた薄膜熱電材料は実用的な固体状態冷凍を可能にする Nano-engineered thin-film thermoelectric materials enable practical solid-state refrigeration
Jake Ballard,Matthew Hubbard,Sung-Jin Jung,Vanessa Rojas,Richard Ung,Junwoo Suh,MinSoo Kim,Joonhyun Lee,Jonathan M. Pierce & Rama Venkatasubramanian
Nature Communications Published:21 May 2025
DOI:https://doi.org/10.1038/s41467-025-59698-y
Abstract
Refrigeration needs are increasing worldwide with a demand for alternates to bulky poorly scalable vapor compression systems. Here, we demonstrate the first proof of practical solid-state refrigeration, using nano-engineered controlled hierarchically engineered superlattice thin-film thermoelectric materials. With 100%-better thermoelectric materials figure of merit, ZT, than the conventional bulk materials near 300 K, we demonstrate (i) module-level ZT greater than 75% and (ii) a system-level refrigeration ZT 70% better than that of bulk devices. Thin-film thermoelectric modules offer 100–300% better coefficient-of-performance than bulk devices depending on operational scenarios; system-level coefficient-of-performance is ~15 for temperature differentials of 1.3 °C. The thin-film devices enable more heat pumping per P-N couple, relevant for distributed and portable refrigeration, and electronics cooling. Beyond the demonstration of nano-engineered materials for a system-level advantage, we utilize 1/1000th active materials with scalable microelectronic manufacturing. The improved efficiency and ultra-low thermoelectric materials usage herald a new beginning in solid-state refrigeration.
