電析過程の配向制御を可能にする界面設計(Interlayer Design for Orientational Control During Electrodeposition)

2026-02-25 パシフィック・ノースウェスト国立研究所(PNNL)

米国エネルギー省系のPacific Northwest National Laboratory(PNNL) 研究チームは、電極表面での金属電着(electrodeposition)の方向制御と膜形成制御の新原理を明らかにしました。彼らは、ポリエチレンオキシド(PEO)などの高分子添加剤が電極/電解質界面のエネルギーと亜鉛(Zn²⁺)イオンの拡散挙動を変えることを発見。これにより、Znが銅(Cu)基板上に層状の滑らかな薄膜として堆積しやすくなります。PEOは成長中のZn結晶とはほとんど相互作用せず、Cu表面との結合を介して(002)配向のZnプレートレット(薄片)の生成を促進し、平坦な層状成長(layer-by-layer growth)を誘導します。この分子レベルの界面設計原理は、エネルギー貯蔵デバイスやメモリ素子の性能向上、機能性材料の高配向膜形成に寄与する基盤的知見として期待されます。

電析過程の配向制御を可能にする界面設計(Interlayer Design for Orientational Control During Electrodeposition)

<関連情報>

ポリマーと基板の結合による金属析出の核形成段階の制御による電極平滑化の実現 Achieving Electrode Smoothing by Controlling the Nucleation Phase of Metal Deposition Through Polymer-Substrate Binding

Ying Xia, Duo Song, Mingyi Zhang, Zheming Wang, Chenyang Shi, Jingshan S. Du, Sun Hae Ra Shin, Mark H. Engelhard, Praveen K. Thallapally, Christine A. Orme, Jinhui Tao, …
Advanced Materials  Published: 23 September 2025
DOI:https://doi.org/10.1002/adma.202503218

Abstract

Polymer additives [like polyethylene oxide (PEO)] are widely used for smooth electrode deposition in aqueous zinc and many other battery systems. However, the precise mechanism by which they regulate morphology and suppress dendrite formation remains unclear. In this study, the knowledge gap is addressed by using in situ electrochemical atomic force microscopy to directly observe the interfacial evolution during Zn electrodeposition and polymer adsorption on Cu substrates in the presence of varying concentrations of ZnSO4 and PEO. Contrary to previous literature assumptions, which emphasize the binding to the growing Zn crystal surfaces or Zn2+ ions, the results demonstrate that PEO smooths Zn films by promoting nucleation of (002)-oriented Zn platelets through interactions with the Cu substrate. Density functional theory simulations support this finding by showing that PEO adsorption on Cu modifies the interfacial energy of Zn/Cu/electrolyte interfaces, favoring the stabilization of Zn (002) on the Cu substrate, as well as confines Zn electrodeposition to a narrow near-surface region. These findings elucidate a novel design principle for electrode smoothing, emphasizing the importance of substrate selection paired with polymer additives that exhibit an attractive interaction with the substrate but minimal interaction with growing crystals, offering a mechanistic perspective for improved battery performance.

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