2025-01-23 バッファロー大学 (UB)
<関連情報>
- https://www.buffalo.edu/news/releases/2025/01/semiconductors-nanoelectronics-2D-materials.html
- https://pubs.acs.org/doi/abs/10.1021/acsnano.4c15271
二次元単分子膜を介した巨大な面外電荷整流とコンダクタンス Enormous Out-of-Plane Charge Rectification and Conductance through Two-Dimensional Monolayers
Anthony Cabanillas,Simran Shahi,Maomao Liu,Hemendra Nath Jaiswal,Sichen Wei,Yu Fu,Anindita Chakravarty,Asma Ahmed,Xiaochi Liu,Jian Sun,Cheng Yang,Won Jong Yoo,Theresia Knobloch,Vasili Perebeinos,Antonio Di Bartolomeo,Tibor Grasser,Fei Yao,Huamin Li
ACS Nano Published: January 15, 2025
DOI:https://doi.org/10.1021/acsnano.4c15271
Abstract
Heterogeneous integration of emerging two-dimensional (2D) materials with mature three-dimensional (3D) silicon-based semiconductor technology presents a promising approach for the future development of energy-efficient, function-rich nanoelectronic devices. In this study, we designed a mixed-dimensional junction structure in which a 2D monolayer (e.g., graphene, MoS2, and h-BN) is sandwiched between a metal (e.g., Ti, Au, and Pd) and a 3D semiconductor (e.g., p-Si) to investigate charge transport properties exclusively in an out-of-plane (OoP) direction. The role of 2D monolayers as either an OoP metal-to-semiconductor charge injection barrier or an OoP semiconductor-to-metal charge collection barrier was comparatively evaluated. Compared to monolayer graphene, monolayer MoS2 and h-BN effectively modulate OoP metal-to-semiconductor charge injection through a barrier tunneling effect. Their effective OoP resistance and resistivity were extracted using a resistors-in-series model. Intriguingly, when functioning as a semiconductor-to-metal charge collection barrier, all 2D monolayers become electronically “transparent” (close to zero resistance) when a high OoP voltage (greater than the built-in voltage) is applied. As a mixed-dimensional integrated diode, the Ti/MoS2/p-Si and Au/MoS2/p-Si configurations exhibit both high OoP rectification ratios (5.4 × 104) and conductance (1.3 × 105 S/m2). Our work demonstrates the tunable OoP charge transport characteristics at a 2D/3D interface, suggesting the opportunity for 2D/3D heterogeneous integration, even with sub-1 nm thick 2D monolayers, to enhance modern Si-based electronic devices.