マイクロエレクトロニクスデバイスの設計改善につながる新発見(New discovery aims to improve the design of microelectronic devices)

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2024-09-11 ミネソタ大学

ミネソタ大学の研究者たちは、次世代のマイクロ電子デバイスの設計改善に役立つ新発見をしました。彼らは電子顕微鏡を使って、スピントロニクス磁気トンネル接合(MTJ)の劣化過程をリアルタイムで観察し、デバイス内部で「ピンホール」が形成されることで故障が始まることを初めて確認しました。この現象は予想よりも低い温度で発生し、デバイスの寿命や効率に大きな影響を与えることがわかりました。この知見は、今後のコンピュータメモリ設計に活かされると期待されています。

<関連情報>

磁気トンネル接合破壊の背後にある原子移動を解明 Uncovering Atomic Migrations Behind Magnetic Tunnel Junction Breakdown

Hwanhui Yun,Deyuan Lyu,Yang Lv,Brandon R. Zink,Pravin Khanal,Bowei Zhou,Wei-Gang Wang,Jian-Ping Wang,K. Andre Mkhoyan
ACS Nano  Published: August 20, 2024
DOI:https://doi.org/10.1021/acsnano.4c08023

Abstract

 

マイクロエレクトロニクスデバイスの設計改善につながる新発見(New discovery aims to improve the design of microelectronic devices)

As advances in computing technology increase demand for efficient data storage solutions, spintronic magnetic tunnel junction (MTJ)-based magnetic random-access memory (MRAM) devices emerge as promising alternatives to traditional charge-based memory devices. Successful applications of such spintronic devices necessitate understanding not only their ideal working principles but also their breakdown mechanisms. Employing an in situ electrical biasing system, atomic-resolution scanning transmission electron microscopy (STEM) reveals two distinct breakdown mechanisms. Soft breakdown occurs at relatively low electric currents due to electromigration, wherein restructuring of MTJ core layers forms ultrathin regions in the dielectric MgO layer and edge conducting paths, reducing device resistance. Complete breakdown occurs at relatively high electric currents due to a combination of joule heating and electromigration, melting MTJ component layers at temperatures below their bulk melting points. Time-resolved, atomic-scale STEM studies of functional devices provide insight into the evolution of structure and composition during device operation, serving as an innovative experimental approach for a wide variety of electronic devices.

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